5962-8606301XX by:

UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28

Part Details for 5962-8606301XX by VLSI Technology Inc

Overview of 5962-8606301XX by VLSI Technology Inc

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Part Details for 5962-8606301XX

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5962-8606301XX Part Data Attributes

5962-8606301XX VLSI Technology Inc
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5962-8606301XX VLSI Technology Inc UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28
Part Life Cycle Code Obsolete
Ihs Manufacturer VLSI TECHNOLOGY INC
Package Description CERAMIC, DIP-28
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 200 ns
JESD-30 Code R-GDIP-T28
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for 5962-8606301XX

This table gives cross-reference parts and alternative options found for 5962-8606301XX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8606301XX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Waferscale Integration Inc 5962-8606301XX vs 5962-8606301XX
FT27C256R-20DMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XX vs FT27C256R-20DMB
5962-8606301XA 32KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 Texas Instruments 5962-8606301XX vs 5962-8606301XA
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation 5962-8606301XX vs 5962-8606301XA
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation 5962-8606301XX vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 5962-8606301XX vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components 5962-8606301XX vs 5962-8606301XX
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 5962-8606301XX vs 5962-8606301XA
FT27C256R-20DM UVPROM, 32KX8, 20ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XX vs FT27C256R-20DM
AT27C256R-20DM/883 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation 5962-8606301XX vs AT27C256R-20DM/883
Part Number Description Manufacturer Compare
NMC27C256BN200 32KX8 OTPROM, 200ns, PDIP28, PLASTIC, DIP-28 Texas Instruments 5962-8606301XX vs NMC27C256BN200
CY27C256-200WC UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Cypress Semiconductor 5962-8606301XX vs CY27C256-200WC
TMS27PC256-20NE 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments 5962-8606301XX vs TMS27PC256-20NE
QP27C256L-200/XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v 5962-8606301XX vs QP27C256L-200/XA
NM27LC256NE200 32KX8 OTPROM, 200ns, PDIP28, PLASTIC, DIP-28 Texas Instruments 5962-8606301XX vs NM27LC256NE200
AT27C256R-20KM UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Atmel Corporation 5962-8606301XX vs AT27C256R-20KM
27C256-20I/J 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc 5962-8606301XX vs 27C256-20I/J
27LV256-20/J 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc 5962-8606301XX vs 27LV256-20/J
AM27C256-200DIB UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 Spansion 5962-8606301XX vs AM27C256-200DIB
FT27C256R-20DI UVPROM, 32KX8, 20ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XX vs FT27C256R-20DI

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