Datasheets
5962-8606301XA by:

UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28

Part Details for 5962-8606301XA by Teledyne e2v

Overview of 5962-8606301XA by Teledyne e2v

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Price & Stock for 5962-8606301XA

Part # Distributor Description Stock Price Buy
DISTI # WS27C256L-20DMB
Avnet Americas EPROM UV 256K-Bit 32K x 8 200ns 28-Pin CDIP - Rail/Tube (Alt: WS27C256L-20DMB) RoHS: Not Compliant Min Qty: 250 Package Multiple: 1 Container: Tube 0
RFQ
Teledyne e2v PROM, UV ERASABLE, 32K X 8, 200 NS ACCESS TIME Lead time: 14 Weeks, 0 Days 0
RFQ

Part Details for 5962-8606301XA

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5962-8606301XA Part Data Attributes

5962-8606301XA Teledyne e2v
Buy Now Datasheet
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5962-8606301XA Teledyne e2v UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28
Part Life Cycle Code Active
Ihs Manufacturer TELEDYNE E2V (UK) LTD
Part Package Code DIP
Package Description CERAMIC, DIP-28
Pin Count 28
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 12.5 V
Qualification Status Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.0003 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

Alternate Parts for 5962-8606301XA

This table gives cross-reference parts and alternative options found for 5962-8606301XA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8606301XA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8606301XC UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 Atmel Corporation 5962-8606301XA vs 5962-8606301XC
FT27C256R-20DC UVPROM, 32KX8, 20ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20DC
FT27C256R-20DI UVPROM, 32KX8, 20ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20DI
FT27C256R-20DM/883 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20DM/883
AT27C256R-20DM/883 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation 5962-8606301XA vs AT27C256R-20DM/883
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation 5962-8606301XA vs 5962-8606301XA
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Waferscale Integration Inc 5962-8606301XA vs 5962-8606301XX
5962-8606301XX 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments 5962-8606301XA vs 5962-8606301XX
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components 5962-8606301XA vs 5962-8606301XA
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 5962-8606301XA vs 5962-8606301XX
Part Number Description Manufacturer Compare
FT27C256R-20LM UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20LM
FT27C256R-20LMB UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Force Technologies Ltd 5962-8606301XA vs FT27C256R-20LMB
UPD27C256AD-20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 NEC Electronics Group 5962-8606301XA vs UPD27C256AD-20
QP27C256L-200/XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v 5962-8606301XA vs QP27C256L-200/XA
QD27C256-200V10 UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 Intel Corporation 5962-8606301XA vs QD27C256-200V10
CY27C256A-200WI UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor 5962-8606301XA vs CY27C256A-200WI
NM27C256N200 OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 Fairchild Semiconductor Corporation 5962-8606301XA vs NM27C256N200
WS27C256L-20DMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Waferscale Integration Inc 5962-8606301XA vs WS27C256L-20DMB
AM27C256-205DCB UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 5962-8606301XA vs AM27C256-205DCB
AM27C256-200/BXA UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 5962-8606301XA vs AM27C256-200/BXA

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