Part Details for 5962-3826701MXX by Teledyne e2v
Overview of 5962-3826701MXX by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
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Part Details for 5962-3826701MXX
5962-3826701MXX CAD Models
5962-3826701MXX Part Data Attributes
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5962-3826701MXX
Teledyne e2v
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Datasheet
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5962-3826701MXX
Teledyne e2v
EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERDIP-32
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 250 ns | |
| Additional Feature | AUTOMATIC WRITE; DATA RETENTION: 10 YEARS | |
| Data Retention Time-Min | 10 | |
| JESD-30 Code | R-GDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 42.2 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 5.72 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for 5962-3826701MXX
This table gives cross-reference parts and alternative options found for 5962-3826701MXX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-3826701MXX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| X28C010CM-25 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, SIDE BRAZED, DIP-32 | Xicor Inc | 5962-3826701MXX vs X28C010CM-25 |
| X28C010CI-25 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, SIDE BRAZED, DIP-32 | Xicor Inc | 5962-3826701MXX vs X28C010CI-25 |
| X28C010DMB-25 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, CERDIP-32 | Xicor Inc | 5962-3826701MXX vs X28C010DMB-25 |
| PYX28C010-25CWMB | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | Pyramid Semiconductor Corporation | 5962-3826701MXX vs PYX28C010-25CWMB |
| 5962-3826701MXB | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 | Xicor Inc | 5962-3826701MXX vs 5962-3826701MXB |
| X28C010C-25 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, SIDE BRAZED, DIP-32 | Xicor Inc | 5962-3826701MXX vs X28C010C-25 |
| FT28C010-25DI-AT | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | Force Technologies Ltd | 5962-3826701MXX vs FT28C010-25DI-AT |
| FT28C010-25D-X | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | Force Technologies Ltd | 5962-3826701MXX vs FT28C010-25D-X |
| X28ST010D-25 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, CERDIP-32 | Xicor Inc | 5962-3826701MXX vs X28ST010D-25 |
| X28C010D-25 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, CERDIP-32 | Xicor Inc | 5962-3826701MXX vs X28C010D-25 |