Part Details for 54HC374/BRAJC by Freescale Semiconductor
Overview of 54HC374/BRAJC by Freescale Semiconductor
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Part Details for 54HC374/BRAJC
54HC374/BRAJC CAD Models
54HC374/BRAJC Part Data Attributes
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54HC374/BRAJC
Freescale Semiconductor
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Datasheet
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54HC374/BRAJC
Freescale Semiconductor
IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,DIP,20PIN,CERAMIC
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MOTOROLA SEMICONDUCTOR PRODUCTS | |
Package Description | DIP, DIP20,.3 | |
Reach Compliance Code | unknown | |
kg CO2e/kg | 12 | |
Average Weight (mg) | 4319.45 | |
CO2e (mg) | 51833.402 | |
Category CO2 Kg | 12 | |
JESD-30 Code | R-XDIP-T20 | |
JESD-609 Code | e0 | |
Logic IC Type | D FLIP-FLOP | |
Number of Functions | 8 | |
Number of Terminals | 20 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP20,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Power Supplies | 2/6 V | |
Qualification Status | Not Qualified | |
Screening Level | 38535Q/M;38534H;883B | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Trigger Type | POSITIVE EDGE |