Part Details for 54F219DM by Texas Instruments
Overview of 54F219DM by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 54F219DM
54F219DM CAD Models
54F219DM Part Data Attributes
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54F219DM
Texas Instruments
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Datasheet
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54F219DM
Texas Instruments
16X4 STANDARD SRAM, 32ns, CDIP16, CERAMIC, DIP-16
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Part Package Code | DIP | |
Package Description | DIP, DIP16,.3 | |
Pin Count | 16 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 32 ns | |
JESD-30 Code | R-GDIP-T16 | |
JESD-609 Code | e0 | |
Length | 19.43 mm | |
Memory Density | 64 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 4 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 16 | |
Number of Words | 16 words | |
Number of Words Code | 16 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 16X4 | |
Output Characteristics | 3-STATE | |
Output Enable | NO | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP16,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Supply Current-Max | 0.055 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | TTL | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
Alternate Parts for 54F219DM
This table gives cross-reference parts and alternative options found for 54F219DM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 54F219DM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27S02APC | Standard SRAM, 16X4, 25ns, TTL, PDIP16, PLASTIC, DIP-16 | Rochester Electronics LLC | 54F219DM vs AM27S02APC |
AM27LS06/BEA | Standard SRAM, 16X4, 65ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | 54F219DM vs AM27LS06/BEA |
CY7C189-25DC | Standard SRAM, 16X4, 25ns, CMOS, CDIP16, 0.300 INCH, CERDIP-16 | Cypress Semiconductor | 54F219DM vs CY7C189-25DC |
AM27LS06PC | Standard SRAM, 16X4, 55ns, TTL, PDIP16, PLASTIC, DIP-16 | AMD | 54F219DM vs AM27LS06PC |
AM27LS02-25DC | Standard SRAM, 16X4, 25ns, Bipolar, CDIP16, DIP-16 | AMD | 54F219DM vs AM27LS02-25DC |
AM27S06DCB | Standard SRAM, 16X4, 35ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | 54F219DM vs AM27S06DCB |
AM27LS03DCB | Standard SRAM, 16X4, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | 54F219DM vs AM27LS03DCB |
AM27S02/BEA | Standard SRAM, 16X4, 50ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | 54F219DM vs AM27S02/BEA |
CY7C189-25PC | Standard SRAM, 16X4, 25ns, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 | Cypress Semiconductor | 54F219DM vs CY7C189-25PC |
N74F219AN | IC 16 X 4 STANDARD SRAM, 8 ns, PDIP16, 0.300 INCH, PLASTIC, MO-001AE, SOT-38-1, DIP-16, Static RAM | NXP Semiconductors | 54F219DM vs N74F219AN |