Datasheets
33C408RPFB-25 by: Maxwell Technologies

Standard SRAM, 512KX8, 25ns, CMOS, DFP-32

Part Details for 33C408RPFB-25 by Maxwell Technologies

Overview of 33C408RPFB-25 by Maxwell Technologies

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Part Details for 33C408RPFB-25

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33C408RPFB-25 Part Data Attributes

33C408RPFB-25 Maxwell Technologies
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33C408RPFB-25 Maxwell Technologies Standard SRAM, 512KX8, 25ns, CMOS, DFP-32
Part Life Cycle Code Obsolete
Ihs Manufacturer MAXWELL TECHNOLOGIES INC
Part Package Code DFP
Package Description DFP,
Pin Count 32
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 25 ns
JESD-30 Code R-XDFP-F32
Length 23.622 mm
Memory Density 4194304 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8
Package Body Material UNSPECIFIED
Package Code DFP
Package Shape RECTANGULAR
Package Style FLATPACK
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 3.937 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form FLAT
Terminal Pitch 1.27 mm
Terminal Position DUAL
Total Dose 100k Rad(Si) V
Width 16.383 mm

Alternate Parts for 33C408RPFB-25

This table gives cross-reference parts and alternative options found for 33C408RPFB-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 33C408RPFB-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MB82208-25PJ Standard SRAM, 512KX8, 25ns, CMOS, PDSO36, 0.400 INCH, PLASTIC, SOJ-36 FUJITSU Semiconductor Limited 33C408RPFB-25 vs MB82208-25PJ
FTS512K8L-25JMB Standard SRAM, 512KX8, 25ns, CMOS, 0.400 INCH, SOJ-36 Force Technologies Ltd 33C408RPFB-25 vs FTS512K8L-25JMB
32C408BRT2FI-17 Standard SRAM, 512KX8, 25ns, CMOS, RAD PAK, LDFP-36 Maxwell Technologies 33C408RPFB-25 vs 32C408BRT2FI-17
FTS512K8-25L36I Standard SRAM, 512KX8, 25ns, CMOS, CDSO36, 0.452 X 0.920 INCH, CERAMIC, LCC-36 Force Technologies Ltd 33C408RPFB-25 vs FTS512K8-25L36I
33C408RTFE-25 Standard SRAM, 512KX8, 25ns, CMOS, DFP-32 Maxwell Technologies 33C408RPFB-25 vs 33C408RTFE-25
FTS512K8-25FS36I Standard SRAM, 512KX8, 25ns, CMOS, PDFP36, FLAT PACK-36 Force Technologies Ltd 33C408RPFB-25 vs FTS512K8-25FS36I
MB82208-25PJ 512KX8 STANDARD SRAM, 25ns, PDSO36, 0.400 INCH, PLASTIC, SOJ-36 FUJITSU Limited 33C408RPFB-25 vs MB82208-25PJ
FTS512K8-25JI Standard SRAM, 512KX8, 25ns, CMOS, PDSO36, 0.400 INCH, SOJ-36 Force Technologies Ltd 33C408RPFB-25 vs FTS512K8-25JI
32C408BRT1FB-17 Standard SRAM, 512KX8, 25ns, CMOS, RAD PAK, LDFP-36 Maxwell Technologies 33C408RPFB-25 vs 32C408BRT1FB-17
WMS512K8B-25FCEA Standard SRAM, 512KX8, 25ns, CMOS, CDFP36, White Microelectronics 33C408RPFB-25 vs WMS512K8B-25FCEA

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