There are no models available for this part yet.
Overview of 335224B00032G by Boyd Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for 335224B00032G by Boyd Corporation
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
305667
|
Avnet Americas | 335224B00032G (Alt: 305667) RoHS: Not Compliant Min Qty: 1680 Package Multiple: 840 Lead time: 14 Weeks, 0 Days | 0 |
|
$1.8922 / $2.2606 | Buy Now | |
DISTI #
75020380
|
RS | Extruded Heatsink, 335224B00032G | Boyd 335224B00032G RoHS: Compliant Min Qty: 1680 Package Multiple: 1 Lead time: 6 Weeks, 0 Days Container: Bulk | 0 |
|
$2.4490 | RFQ | |
DISTI #
335224B00032G
|
TME | Heatsink: extruded, grilled, BGA,FPGA, black, L: 25.02mm, W: 25.02mm Min Qty: 840 | 0 |
|
$2.1900 | RFQ |
CAD Models for 335224B00032G by Boyd Corporation
Part Data Attributes for 335224B00032G by Boyd Corporation
|
|
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Rohs Code
|
Yes
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Part Life Cycle Code
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Contact Manufacturer
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Ihs Manufacturer
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BOYD CORP
|
Package Description
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ROHS COMPLIANT
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Reach Compliance Code
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unknown
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Factory Lead Time
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14 Weeks
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Body Material
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ALUMINUM
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Color
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BLACK
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Construction
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FIN
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Fin Orientation
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OMNIDIRECT
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Finish
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ANODIZED
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Height
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9.9 mm
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Length
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25.02 mm
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Profile
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PIN FIN ARRAY
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Thermal Support Device Type
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HEAT SINK
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Width
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25.02 mm
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