Part Details for 2N5551RLRA by onsemi

The recommended PCB footprint for the 2N5551RLRA is a standard SOT-23 package with a 1.3mm x 1.3mm body size and 0.5mm lead pitch. A recommended land pattern can be found in the onsemi packaging documentation.

To ensure reliable operation of the 2N5551RLRA in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and minimizing power dissipation. Additionally, the device should be operated within its recommended temperature range of -55°C to 150°C.

The maximum safe operating area (SOA) for the 2N5551RLRA is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general guideline, the SOA can be approximated by the device's maximum power dissipation (PD) and maximum junction temperature (TJ). For the 2N5551RLRA, PD = 625 mW and TJ = 150°C.

While the 2N5551RLRA can be used as a switch, it is not recommended for high-frequency applications due to its relatively high transition frequency (ft) of 100 MHz. For high-frequency switching applications, a transistor with a higher ft and lower capacitance is recommended.

The 2N5551RLRA has a human body model (HBM) ESD rating of 2 kV and a machine model (MM) ESD rating of 200 V. To ensure ESD protection, it is recommended to follow proper handling and storage procedures, such as using ESD-safe materials, grounding personnel, and using ESD protection devices such as TVS diodes or ESD arrays.