Datasheets
28C16AF-25B/XA by: Microchip Technology Inc

IC,EEPROM,2KX8,CMOS,DIP,24PIN,CERAMIC

Part Details for 28C16AF-25B/XA by Microchip Technology Inc

Overview of 28C16AF-25B/XA by Microchip Technology Inc

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Part Details for 28C16AF-25B/XA

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28C16AF-25B/XA Part Data Attributes

28C16AF-25B/XA Microchip Technology Inc
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28C16AF-25B/XA Microchip Technology Inc IC,EEPROM,2KX8,CMOS,DIP,24PIN,CERAMIC
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 250 ns
Command User Interface NO
Data Polling YES
Endurance 10000 Write/Erase Cycles
JESD-30 Code R-XDIP-T24
JESD-609 Code e0
Memory Density 16384 bit
Memory IC Type EEPROM
Memory Width 8
Number of Terminals 24
Number of Words 2048 words
Number of Words Code 2000
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 2KX8
Package Body Material CERAMIC
Package Code DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.00015 A
Supply Current-Max 0.045 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Toggle Bit NO
Write Cycle Time-Max (tWC) 0.2 ms

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