Datasheets
27LV512-20/J by: Microchip Technology Inc

64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28

Part Details for 27LV512-20/J by Microchip Technology Inc

Overview of 27LV512-20/J by Microchip Technology Inc

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Part Details for 27LV512-20/J

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27LV512-20/J Part Data Attributes:

27LV512-20/J Microchip Technology Inc
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27LV512-20/J Microchip Technology Inc 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Part Package Code DIP
Package Description 0.600 INCH, CERDIP-28
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Length 36.83 mm
Memory Density 524288 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.461 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.043 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for 27LV512-20/J

This table gives cross-reference parts and alternative options found for 27LV512-20/J. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27LV512-20/J, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27C512L-200/BXA UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 27LV512-20/J vs AM27C512L-200/BXA
TMS27C512-2JE 524 288-Bit Programmable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments 27LV512-20/J vs TMS27C512-2JE
AM27C512-200DI UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 27LV512-20/J vs AM27C512-200DI
AM27C512L-200DE UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD 27LV512-20/J vs AM27C512L-200DE
MSM27512-20AS UVPROM, 64KX8, 200ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 OKI Electric Industry Co Ltd 27LV512-20/J vs MSM27512-20AS
TMS27C512-20JE4 64KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments 27LV512-20/J vs TMS27C512-20JE4
AT27C512R-20DI UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation 27LV512-20/J vs AT27C512R-20DI
AM27C512-200DCB UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion 27LV512-20/J vs AM27C512-200DCB
TD27513-200V10 UVPROM, 64KX8, 200ns, NMOS, CDIP28, CERDIP-28 Intel Corporation 27LV512-20/J vs TD27513-200V10
M27512-20F6 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics 27LV512-20/J vs M27512-20F6
Part Number Description Manufacturer Compare
NM27P512Q200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation 27LV512-20/J vs NM27P512Q200
TMM27512AD-20 IC 64K X 8 UVPROM, 200 ns, CDIP28, CERDIP-28, Programmable ROM Toshiba America Electronic Components 27LV512-20/J vs TMM27512AD-20
M27512-2F6 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics 27LV512-20/J vs M27512-2F6
NMC27C512AQE200 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments 27LV512-20/J vs NMC27C512AQE200
NMC27C512AQ200 IC 64K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation 27LV512-20/J vs NMC27C512AQ200
QD27513-2 UVPROM, 64KX8, 200ns, NMOS, CDIP28, CERDIP-28 Intel Corporation 27LV512-20/J vs QD27513-2
NM27LC512QE200 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 Texas Instruments 27LV512-20/J vs NM27LC512QE200
27C512-20I/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc 27LV512-20/J vs 27C512-20I/J
27C512-20E/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc 27LV512-20/J vs 27C512-20E/J
27C512-20/J 64K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc 27LV512-20/J vs 27C512-20/J

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