Datasheets
27HC256L-90/J by:

32K X 8 UVPROM, 90 ns, CDIP28, 0.600 INCH, CERDIP-28

Part Details for 27HC256L-90/J by Microchip Technology Inc

Overview of 27HC256L-90/J by Microchip Technology Inc

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Price & Stock for 27HC256L-90/J

Part # Distributor Description Stock Price Buy
DISTI # 86085636
Verical 27HC256L-90/J Min Qty: 74 Package Multiple: 1 Date Code: 9101 Americas - 2766
  • 74 $5.0750
  • 100 $4.8625
  • 500 $4.6625
  • 1,000 $4.4000
$4.4000 / $5.0750 Buy Now
DISTI # 86085819
Verical 27HC256L-90/J Min Qty: 74 Package Multiple: 1 Americas - 139
  • 74 $5.0750
  • 100 $4.8625
  • 500 $4.6625
  • 1,000 $4.4000
$4.4000 / $5.0750 Buy Now
Rochester Electronics 27HC256 - 256K (32K X 8) CMOS EPROM ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 139
  • 1 $4.1400
  • 25 $4.0600
  • 100 $3.8900
  • 500 $3.7300
  • 1,000 $3.5200
$3.5200 / $4.1400 Buy Now

Part Details for 27HC256L-90/J

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27HC256L-90/J Part Data Attributes

27HC256L-90/J Microchip Technology Inc
Buy Now Datasheet
Compare Parts:
27HC256L-90/J Microchip Technology Inc 32K X 8 UVPROM, 90 ns, CDIP28, 0.600 INCH, CERDIP-28
Part Life Cycle Code Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Part Package Code DIP
Package Description 0.600 INCH, CERDIP-28
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Factory Lead Time 4 Weeks
Access Time-Max 90 ns
JESD-30 Code R-GDIP-T28
Memory Density 262144 bit
Memory IC Type EPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.055 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for 27HC256L-90/J

This table gives cross-reference parts and alternative options found for 27HC256L-90/J. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27HC256L-90/J, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
CY27C256-90WI Cypress Semiconductor Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 27HC256L-90/J vs CY27C256-90WI
CY27C256A-90WI Cypress Semiconductor Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 27HC256L-90/J vs CY27C256A-90WI
5962-8606307UA QP Semiconductor Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, CERAMIC, DIP-28 27HC256L-90/J vs 5962-8606307UA
5962-8606307XX Micross Components Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, 27HC256L-90/J vs 5962-8606307XX
5962-8606317XA Cypress Semiconductor Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, CERAMIC, DIP-28 27HC256L-90/J vs 5962-8606317XA
IS27C256-90CW Integrated Silicon Solution Inc Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 27HC256L-90/J vs IS27C256-90CW
5962-8606317UA QP Semiconductor Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, CERAMIC, DIP-28 27HC256L-90/J vs 5962-8606317UA
5962-8606317XA Teledyne e2v Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, CERAMIC, DIP-28 27HC256L-90/J vs 5962-8606317XA
5962-8606317XA QP Semiconductor Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, CERAMIC, DIP-28 27HC256L-90/J vs 5962-8606317XA
Part Number Manufacturer Composite Price Description Compare
QP27C256L-90/YA Teledyne e2v Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 27HC256L-90/J vs QP27C256L-90/YA
QP27C256-90/QYA Teledyne e2v Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 27HC256L-90/J vs QP27C256-90/QYA
27HC256-90E/J Microchip Technology Inc Check for Price 32K X 8 UVPROM, 90 ns, CDIP28, 0.600 INCH, CERDIP-28 27HC256L-90/J vs 27HC256-90E/J
27HC256-90I/J Microchip Technology Inc Check for Price 32K X 8 UVPROM, 90 ns, CDIP28, 0.600 INCH, CERDIP-28 27HC256L-90/J vs 27HC256-90I/J
5962-8606307XX AMD Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 27HC256L-90/J vs 5962-8606307XX
WS27C256F-90DMB Waferscale Integration Inc Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, 27HC256L-90/J vs WS27C256F-90DMB
5662-860637XA Teledyne e2v Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 27HC256L-90/J vs 5662-860637XA
5962-8606307XX Atmel Corporation Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 27HC256L-90/J vs 5962-8606307XX
5662-8606317QYA Teledyne e2v Check for Price UVPROM, 32KX8, 90ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 27HC256L-90/J vs 5662-8606317QYA
27HC256L-90I/J Microchip Technology Inc Check for Price 32K X 8 UVPROM, 90 ns, CDIP28, 0.600 INCH, CERDIP-28 27HC256L-90/J vs 27HC256L-90I/J

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