Part Details for 27LV64-25I/J by Microchip Technology Inc
Overview of 27LV64-25I/J by Microchip Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
Part Details for 27LV64-25I/J
27LV64-25I/J CAD Models
27LV64-25I/J Part Data Attributes
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27LV64-25I/J
Microchip Technology Inc
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Datasheet
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27LV64-25I/J
Microchip Technology Inc
8K X 8 UVPROM, 250 ns, CDIP28, 0.600 INCH, CERDIP-28
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Part Package Code | DIP | |
| Package Description | 0.600 INCH, CERDIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 36.83 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 13 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.461 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 27LV64-25I/J
This table gives cross-reference parts and alternative options found for 27LV64-25I/J. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27LV64-25I/J, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TMS27C64JL4 | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | 27LV64-25I/J vs TMS27C64JL4 |
| 27C64MQ25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | 27LV64-25I/J vs 27C64MQ25 |
| AM27C64-255DEB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 27LV64-25I/J vs AM27C64-255DEB |
| TMS27C64JE4 | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | 27LV64-25I/J vs TMS27C64JE4 |
| TMS2764-25JL | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | 27LV64-25I/J vs TMS2764-25JL |
| M2764AF1 | 8KX8 UVPROM, 250ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | STMicroelectronics | 27LV64-25I/J vs M2764AF1 |
| AM27C64-255DCB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Spansion | 27LV64-25I/J vs AM27C64-255DCB |
| 27C64MQB/B25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | 27LV64-25I/J vs 27C64MQB/B25 |
| M27C64A-25F1 | 8KX8 UVPROM, 250ns, CDIP28, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | 27LV64-25I/J vs M27C64A-25F1 |
| MBM27C64-25-XZ | 8KX8 UVPROM, 250ns, CDIP28, CERDIP-28 | FUJITSU Limited | 27LV64-25I/J vs MBM27C64-25-XZ |