Part Details for 27HC256L-70/J by Microchip Technology Inc
Overview of 27HC256L-70/J by Microchip Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for 27HC256L-70/J
27HC256L-70/J CAD Models
27HC256L-70/J Part Data Attributes
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27HC256L-70/J
Microchip Technology Inc
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Datasheet
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27HC256L-70/J
Microchip Technology Inc
32K X 8 UVPROM, 70 ns, CDIP28, 0.600 INCH, CERDIP-28
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Part Package Code | DIP | |
| Package Description | 0.600 INCH, CERDIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 70 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 36.83 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | EPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 13 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.461 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.092 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 27HC256L-70/J
This table gives cross-reference parts and alternative options found for 27HC256L-70/J. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27HC256L-70/J, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8606308XA | UVPROM, 32KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28 | Waferscale Integration Inc | 27HC256L-70/J vs 5962-8606308XA |
| AM27C256-70DI | UVPROM, 32KX8, 70ns, CMOS, CDIP28, DIP-28 | Spansion | 27HC256L-70/J vs AM27C256-70DI |
| M27C256B-70F7X | 32KX8 UVPROM, 70ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | 27HC256L-70/J vs M27C256B-70F7X |
| 5962-8606308XA | UVPROM, 32KX8, 70ns, CMOS, CDIP28, | Teledyne e2v | 27HC256L-70/J vs 5962-8606308XA |
| AT27HC256R-70DM/883 | UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Atmel Corporation | 27HC256L-70/J vs AT27HC256R-70DM/883 |
| 5962-8606308XA | UVPROM, 32KX8, 70ns, CMOS, CDIP28 | QP Semiconductor | 27HC256L-70/J vs 5962-8606308XA |
| AM27C256-70DEB | UVPROM, 32KX8, 70ns, CMOS, CDIP28, DIP-28 | Spansion | 27HC256L-70/J vs AM27C256-70DEB |
| MSM27C256H-70AS | UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | OKI Electric Industry Co Ltd | 27HC256L-70/J vs MSM27C256H-70AS |
| M27C256BF | 32KX8 UVPROM, 70ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | 27HC256L-70/J vs M27C256BF |
| CY27C256A-70WC | UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 | Cypress Semiconductor | 27HC256L-70/J vs CY27C256A-70WC |