Part Details for 27C64T-25/L by Microchip Technology Inc
Overview of 27C64T-25/L by Microchip Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Part Details for 27C64T-25/L
27C64T-25/L CAD Models
27C64T-25/L Part Data Attributes
|
27C64T-25/L
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
27C64T-25/L
Microchip Technology Inc
8K X 8 OTPROM, 250 ns, PQCC32, PLASTIC, LCC-32
|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Part Package Code | QFJ | |
Package Description | PLASTIC, LCC-32 | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 250 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PQCC-J32 | |
JESD-609 Code | e0 | |
Length | 13.97 mm | |
Memory Density | 65536 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC32,.5X.6 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 13 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.556 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.028 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 11.43 mm |