Part Details for 27C256MEQG/B20 by Thales Group
Overview of 27C256MEQG/B20 by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 10146110-VH5B20 | Amphenol Communications Solutions | Millipacs, Accessories, Pressfit insertion tool for 5 row Vertical header Type B20 | |
| HM2P73PN5110GFLF | Amphenol Communications Solutions | Back Plane Connectors,2mm Hard Metric Series,Millipacs, 5 Row Vertical Header, Type B20, 100 Signal Pin, Press Fit Tail, 250 mating cycles-Rear Plug up and ROHS Compliant | |
| HM2P73PD5110N9LF | Amphenol Communications Solutions | Back Plane Connectors,2mm Hard Metric Series,Millipacs, 5 Row Vertical Header, Type B20, 100 Signal Pin, Press Fit Tail, 250 mating cycles and ROHS Compliant |
Part Details for 27C256MEQG/B20
27C256MEQG/B20 CAD Models
27C256MEQG/B20 Part Data Attributes
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27C256MEQG/B20
Thales Group
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Datasheet
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27C256MEQG/B20
Thales Group
UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | QFJ | |
| Package Description | , | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-CQCC-N32 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | NFC 96883 Class G | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | NO LEAD | |
| Terminal Position | QUAD |
Alternate Parts for 27C256MEQG/B20
This table gives cross-reference parts and alternative options found for 27C256MEQG/B20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27C256MEQG/B20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AS27C256A-20ECAM/MIL | Memory IC | Micross Components | 27C256MEQG/B20 vs AS27C256A-20ECAM/MIL |
| AS27C256-20ECAXT | UVPROM, 32KX8, 200ns, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 | Micross Components | 27C256MEQG/B20 vs AS27C256-20ECAXT |
| 5962-8606301YA | UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 | QP Semiconductor | 27C256MEQG/B20 vs 5962-8606301YA |
| MBM27256-20CV | UVPROM, 32KX8, 200ns, NMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Semiconductor Limited | 27C256MEQG/B20 vs MBM27256-20CV |
| AM27256-20/BUC | UVPROM, 32KX8, 200ns, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | 27C256MEQG/B20 vs AM27256-20/BUC |
| MBM27256-20 | UVPROM, 32KX8, 200ns, NMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Semiconductor Limited | 27C256MEQG/B20 vs MBM27256-20 |
| 27C256MEQ7B/Y20 | UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 | Thales Group | 27C256MEQG/B20 vs 27C256MEQ7B/Y20 |
| AS27C256-20ECAM | UVPROM, 32KX8, 200ns, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 | Micross Components | 27C256MEQG/B20 vs AS27C256-20ECAM |
| 5962-8606311YX | UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 | QP Semiconductor | 27C256MEQG/B20 vs 5962-8606311YX |
| 5962-8606311YA | UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | 27C256MEQG/B20 vs 5962-8606311YA |