There are no models available for this part yet.
Overview of 27C256MEQ20 by Teledyne e2v
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for 27C256MEQ20 by Teledyne e2v
Part Data Attributes for 27C256MEQ20 by Teledyne e2v
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|---|---|
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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ATMEL GRENOBLE
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Part Package Code
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QFJ
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Package Description
|
,
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Pin Count
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32
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Reach Compliance Code
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unknown
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ECCN Code
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3A001.A.2.C
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HTS Code
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8542.32.00.61
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Access Time-Max
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200 ns
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JESD-30 Code
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R-CQCC-N32
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Memory Density
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262144 bit
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Memory IC Type
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UVPROM
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Memory Width
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8
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Number of Functions
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1
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Number of Terminals
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32
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Number of Words
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32768 words
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Number of Words Code
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32000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Organization
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32KX8
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Shape
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RECTANGULAR
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Package Style
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CHIP CARRIER
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Parallel/Serial
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PARALLEL
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Qualification Status
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Not Qualified
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Supply Current-Max
|
0.1 mA
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Supply Voltage-Max (Vsup)
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5.5 V
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Supply Voltage-Min (Vsup)
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4.5 V
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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MILITARY
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Terminal Form
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NO LEAD
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Terminal Position
|
QUAD
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Alternate Parts for 27C256MEQ20
This table gives cross-reference parts and alternative options found for 27C256MEQ20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27C256MEQ20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM27256-20 | 32KX8 UVPROM, 200ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Limited | 27C256MEQ20 vs MBM27256-20 |
| AM27C256-205LCB | UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | 27C256MEQ20 vs AM27C256-205LCB |
| AS27C256-20ECAI | UVPROM, 32KX8, 200ns, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 | Micross Components | 27C256MEQ20 vs AS27C256-20ECAI |
| MBM27C256A-20WTV | 32KX8 UVPROM, 200ns, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | FUJITSU Limited | 27C256MEQ20 vs MBM27C256A-20WTV |
| QP27C256L-250/UA | UVPROM, 32KX8, 200ns, CMOS, JLCC-32 | Teledyne e2v | 27C256MEQ20 vs QP27C256L-250/UA |
| AS27C256-20ECAM | UVPROM, 32KX8, 200ns, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 | Micross Components | 27C256MEQ20 vs AS27C256-20ECAM |
| 27C256MEQ20 | UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 | Thales Group | 27C256MEQ20 vs 27C256MEQ20 |
| CY27C256A-200QMB | UVPROM, 32KX8, 200ns, CMOS, CQCC32, HERMETIC SEALED, WINDOWED, LCC-32 | Cypress Semiconductor | 27C256MEQ20 vs CY27C256A-200QMB |
| AM27256-2LC | UVPROM, 32KX8, 200ns, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | 27C256MEQ20 vs AM27256-2LC |
| QP27C256L-200/YC | UVPROM, 32KX8, 200ns, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | 27C256MEQ20 vs QP27C256L-200/YC |