Part Details for 25LC320/WF by Microchip Technology Inc
Overview of 25LC320/WF by Microchip Technology Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for 25LC320/WF
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
25LC320/WF-ND
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DigiKey | IC EEPROM 32KBIT SPI 2MHZ DIE Lead time: 4 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
DISTI #
25LC320/WF
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Microchip Technology Inc | 32k, 4K X 8 , 2.5V SER EE, WAFER ON FRAME, Projected EOL: 2034-05-16 RoHS: Compliant pbFree: Yes Min Qty: 1 Package Multiple: 1 Container: WFRAME |
0 Alternates Available |
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$0.5900 / $0.8000 | Buy Now |
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NAC | 32k, 4K X 8 , 2.5V SER EE, WAFER on FRAME, Package: 0 WAFER WFRAME - Action Code: NCNR RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
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RFQ |
Part Details for 25LC320/WF
25LC320/WF CAD Models
25LC320/WF Part Data Attributes
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25LC320/WF
Microchip Technology Inc
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Datasheet
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25LC320/WF
Microchip Technology Inc
32k, 4K X 8 , 2.5V SER EE, WAFER ON FRAME, 0C to +70C, Wafer-Frame, WFRAME
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Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | DIE | |
Reach Compliance Code | compliant | |
Additional Feature | ALSO OPERATES WITH 2.5V MIN @ 5MHZ AND 1.8VMIN @3MHZ | |
Clock Frequency-Max (fCLK) | 10 MHz | |
Data Retention Time-Min | 200 | |
Endurance | 1000000 Write/Erase Cycles | |
I/O Type | SEPARATE | |
JESD-30 Code | R-XUUC-N | |
Memory Density | 32768 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Words | 4096 words | |
Number of Words Code | 4000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 4KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Equivalence Code | DIE OR CHIP | |
Package Shape | RECTANGULAR | |
Package Style | UNCASED CHIP | |
Parallel/Serial | SERIAL | |
Programming Voltage | 5 V | |
Screening Level | TS 16949 | |
Serial Bus Type | SPI | |
Supply Current-Max | 0.005 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Position | UPPER | |
Write Cycle Time-Max (tWC) | 5 ms | |
Write Protection | HARDWARE |