24LC00/S
Microchip Technology Inc
Description: 17 byte, 128 bit, 2.5V SEE DIE IN WAFFLE PACK, 0C to +70C, Die-Waffle, WPAC

Overview of 24LC00/S by Microchip Technology Inc

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  • Distributor Offerings: ( 3 listings )
  • Number of FFF Equivalents: ( 0 crosses )
  • CAD Models: ( Request Part )
  • Number of Functional Equivalents: ( 0 crosses )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )
Where used in Applications: Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for 24LC00/S by Microchip Technology Inc

Part # Manufacturer Description Stock Price Buy
DISTI # 24LC00/S-ND
DigiKey IC EEPROM 128B I2C 400KHZ DIE Lead time: 4 Weeks Container: Tray Temporarily Out of Stock
Buy Now
DISTI # 24LC00/S
Microchip Technology Inc 17 byte, 128 bit, 2.5V SEE DIE IN WAFFLE PACK, Projected EOL: 2034-05-16 RoHS: Compliant pbFree: Yes Min Qty: 1 Package Multiple: 1 Container: WPAC 0

Alternates Available
  • 1 $0.2600
  • 100 $0.2500
  • 1,000 $0.2400
  • 5,000 $0.2300
  • 10,000 $0.2100
$0.2100 / $0.2600 Buy Now
NAC 16 byte, 128 bit, 2.5V SEE DIE in WAFFLE PK, Package: 0 DICE WPAC - Action Code: NCNR RoHS: Compliant Min Qty: 1 Package Multiple: 1 0
RFQ

CAD Models for 24LC00/S by Microchip Technology Inc
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Part Data Attributes for 24LC00/S by Microchip Technology Inc

24LC00/S
Microchip Technology Inc
-
-
Part Life Cycle Code
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
Package Description
DIE
Reach Compliance Code
compliant
Clock Frequency-Max (fCLK)
0.4 MHz
Data Retention Time-Min
200
Endurance
1000000 Write/Erase Cycles
I/O Type
COMMON
I2C Control Byte
1010XXXR
JESD-30 Code
R-XUUC-N
Memory Density
128 bit
Memory IC Type
EEPROM
Memory Width
8
Number of Functions
1
Number of Ports
1
Number of Words
16 words
Number of Words Code
16
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
16X8
Output Characteristics
OPEN-DRAIN
Package Body Material
UNSPECIFIED
Package Code
DIE
Package Equivalence Code
DIE OR CHIP
Package Shape
RECTANGULAR
Package Style
UNCASED CHIP
Parallel/Serial
SERIAL
Programming Voltage
5 V
Screening Level
TS 16949
Serial Bus Type
I2C
Standby Current-Max
0.000001 A
Supply Current-Max
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
NO LEAD
Terminal Position
UPPER
Write Cycle Time-Max (tWC)
4 ms
Want to compare parts?
  1. 24LC00/S
    Microchip Technology Inc
    17 byte, 128 bit, 2.5V SEE DIE IN WAFFLE PACK, 0C to +70C, Die-Waffle, WPAC
    VS

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