Part Details for 23S09-1HDCG by Integrated Device Technology Inc
Overview of 23S09-1HDCG by Integrated Device Technology Inc
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for 23S09-1HDCG
23S09-1HDCG CAD Models
23S09-1HDCG Part Data Attributes:
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23S09-1HDCG
Integrated Device Technology Inc
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Datasheet
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23S09-1HDCG
Integrated Device Technology Inc
SOIC-16, Tube
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | SOIC | |
Package Description | SOIC-16 | |
Pin Count | 16 | |
Manufacturer Package Code | DCG16 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Family | 23S | |
Input Conditioning | MUX | |
JESD-30 Code | R-PDSO-G16 | |
JESD-609 Code | e3 | |
Length | 9.93 mm | |
Logic IC Type | PLL BASED CLOCK DRIVER | |
Max I(ol) | 0.012 A | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Inverted Outputs | ||
Number of Terminals | 16 | |
Number of True Outputs | 9 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP16,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Same Edge Skew-Max (tskwd) | 0.7 ns | |
Seated Height-Max | 1.72 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 3.9 mm | |
fmax-Min | 133 MHz |