Part Details for 21L02N by Philips Semiconductors
Overview of 21L02N by Philips Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for 21L02N
21L02N CAD Models
21L02N Part Data Attributes
|
|
21L02N
Philips Semiconductors
Buy Now
Datasheet
|
Compare Parts:
21L02N
Philips Semiconductors
Standard SRAM, 1KX1, 1000ns, MOS, PDIP16
|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | PHILIPS SEMICONDUCTORS | |
| Package Description | DIP, DIP16,.3 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 1000 ns | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PDIP-T16 | |
| JESD-609 Code | e0 | |
| Memory Density | 1024 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 1024 words | |
| Number of Words Code | 1000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1KX1 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Surface Mount | NO | |
| Technology | MOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |