Part Details for 1N5767 by TE Connectivity
Overview of 1N5767 by TE Connectivity
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Aerospace and Defense
Energy and Power Systems
Part Details for 1N5767
1N5767 CAD Models
1N5767 Part Data Attributes:
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1N5767
TE Connectivity
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Datasheet
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1N5767
TE Connectivity
SILICON, PIN DIODE, HERMETIC SEALED, GLASS PACKAGE-2
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TYCO ELECTRONICS M/A-COM | |
Package Description | HERMETIC SEALED, GLASS PACKAGE-2 | |
Pin Count | 2 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00.80 | |
Application | SWITCHING | |
Case Connection | ISOLATED | |
Configuration | SINGLE | |
Diode Capacitance-Max | 0.4 pF | |
Diode Element Material | SILICON | |
Diode Forward Resistance-Max | 2.5 Ω | |
Diode Res Test Current | 100 mA | |
Diode Type | PIN DIODE | |
Frequency Band | HIGH FREQUENCY TO S BAND | |
JESD-30 Code | O-LALF-W2 | |
JESD-609 Code | e0 | |
Minority Carrier Lifetime-Nom | 1 µs | |
Number of Elements | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 175 °C | |
Operating Temperature-Min | -65 °C | |
Package Body Material | GLASS | |
Package Shape | ROUND | |
Package Style | LONG FORM | |
Power Dissipation-Max | 0.25 W | |
Qualification Status | Not Qualified | |
Surface Mount | NO | |
Technology | POSITIVE-INTRINSIC-NEGATIVE | |
Terminal Finish | TIN LEAD | |
Terminal Form | WIRE | |
Terminal Position | AXIAL |
Alternate Parts for 1N5767
This table gives cross-reference parts and alternative options found for 1N5767. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 1N5767, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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1N5767 | 100V, SILICON, PIN DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | Avago Technologies | 1N5767 vs 1N5767 |
5082-3080#T25 | 100V, SILICON, PIN DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | Avago Technologies | 1N5767 vs 5082-3080#T25 |
1N5767 | Pin Diode, 100V V(BR), Silicon, | Unitrode Corporation | 1N5767 vs 1N5767 |
5082-3080 | 100V, SILICON, PIN DIODE, HERMETIC SEALED, GLASS PACKAGE-2 | Avago Technologies | 1N5767 vs 5082-3080 |
1N5767 | Pin Diode, 100V V(BR), Silicon, | Unitrode Corp (RETIRED) | 1N5767 vs 1N5767 |
5082-3080 | Pin Diode, 100V V(BR), Silicon, GLASS, 15, 2 PIN | Advanced Semiconductor Inc | 1N5767 vs 5082-3080 |
5082-3080 | Pin Diode, 100V V(BR), Silicon, HERMETIC SEALED, GLASS PACKAGE-2 | Broadcom Limited | 1N5767 vs 5082-3080 |
5082-3080#T25 | Pin Diode, 100V V(BR), Silicon, HERMETIC SEALED, GLASS PACKAGE-2 | Broadcom Limited | 1N5767 vs 5082-3080#T25 |
1N5767 | Pin Diode, 100V V(BR), Silicon | Microchip Technology Inc | 1N5767 vs 1N5767 |
5082-3080#T50 | Pin Diode, 100V V(BR), Silicon, HERMETIC SEALED, GLASS PACKAGE-2 | Broadcom Limited | 1N5767 vs 5082-3080#T50 |