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RF and Microwave / RF/Microwave Couplers / 1M810S
Datasheets
1M810S by:
TTM Technologies
Anaren Microwave
TTM Technologies
Not Found

Directional Coupler, 5000MHz Min, 6000MHz Max, 0.3dB Insertion Loss-Max,

Part Details for 1M810S by TTM Technologies

Results Overview of 1M810S by TTM Technologies

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Applications Automotive

1M810S Information

1M810S by TTM Technologies is an RF/Microwave Coupler.
RF/Microwave Couplers are under the broader part category of RF and Microwave Components.

RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.

Price & Stock for 1M810S

Part # Distributor Description Stock Price Buy
DISTI # 1173-1M810SCT-ND
DigiKey RF DIR COUPLER 5GHZ-6GHZ SMD Min Qty: 1 Lead time: 12 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) 3694
In Stock
  • 1 $6.1700
  • 10 $4.7240
  • 25 $4.2940
  • 100 $3.7691
  • 250 $3.4919
  • 500 $3.3132
  • 1,000 $3.1578
  • 2,000 $2.6250
$2.6250 / $6.1700 Buy Now
DISTI # 620-1M810S
Mouser Electronics Signal Conditioning 5-6GHz IL .3dB 15W coupling 10dB RoHS: Compliant 1696
  • 1 $5.4700
  • 10 $4.5100
  • 25 $4.1200
  • 50 $3.8800
  • 100 $3.6500
  • 250 $3.3500
  • 500 $3.1500
  • 1,000 $3.0000
  • 2,000 $2.6200
$2.6200 / $5.4700 Buy Now
DISTI # 1M810S-CT
Richardson RFPD RF DIRECTIONAL COUPLER RoHS: Compliant Min Qty: 1 692
  • 1 $1.9200
$1.9200 Buy Now
DISTI # 1M810S-REEL
Richardson RFPD RF DIRECTIONAL COUPLER RoHS: Compliant Min Qty: 2000 0
  • 2,000 $2.8900
  • 2,500 $2.7800
$2.7800 / $2.8900 Buy Now

Part Details for 1M810S

1M810S CAD Models

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1M810S Part Data Attributes

Parametric Data
1M810S TTM Technologies
Buy Now Datasheet
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1M810S TTM Technologies Directional Coupler, 5000MHz Min, 6000MHz Max, 0.3dB Insertion Loss-Max,
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TTM TECHNOLOGIES INC
Reach Compliance Code compliant
Characteristic Impedance 50 Ω
Construction COMPONENT
Input Power-Max (CW) 41.76 dBm
Insertion Loss-Max 0.3 dB
Operating Frequency-Max 6000 MHz
Operating Frequency-Min 5000 MHz
Operating Temperature-Max 85 °C
Operating Temperature-Min -55 °C
RF/Microwave Device Type DIRECTIONAL COUPLER
Terminal Finish Tin (Sn) - immersion
VSWR-Max 1.33

1M810S Related Parts

1M810S Frequently Asked Questions (FAQ)

  • TTM Technologies recommends a 4-layer PCB stack-up with a dedicated ground plane and a signal layer adjacent to the ground plane to minimize signal loss and crosstalk. A microstrip or stripline design is recommended for the transmission lines.

  • Proper thermal management can be achieved by providing a thermal path from the device to a heat sink or a metal core PCB. A thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K is recommended. Additionally, ensure that the PCB design allows for adequate airflow around the device.

  • TTM Technologies recommends a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds. A solder paste with a melting point of 217°C (423°F) or higher is recommended. Hand soldering is not recommended due to the device's small size and high pin count.

  • Use a combination of signal integrity analysis tools, such as TDR or VNA, and power supply noise analysis tools, such as a spectrum analyzer or oscilloscope, to identify the root cause of the issue. Consult the datasheet and application notes for guidance on signal integrity and power supply design. Additionally, consult with TTM Technologies' technical support team for further assistance.

  • Yes, the 1M810S is a high-frequency device and requires careful consideration of EMI/EMC during the design process. Ensure that the PCB design includes adequate shielding, filtering, and grounding to minimize EMI emissions and susceptibility. Consult the datasheet and application notes for guidance on EMI/EMC design considerations.