Part Details for 1B51AN by Analog Devices Inc
Results Overview of 1B51AN by Analog Devices Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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1B51AN Information
1B51AN by Analog Devices Inc is an Other Signal Circuit.
Other Signal Circuits are under the broader part category of Signal Circuits.
A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.
Part Details for 1B51AN
1B51AN CAD Models
1B51AN Part Data Attributes
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1B51AN
Analog Devices Inc
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Datasheet
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1B51AN
Analog Devices Inc
Isolated mV/Thermocouple Signal Conditioner
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Part Package Code | DMA | |
Package Description | DIP-38 | |
Pin Count | 12 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 9033.00.90.00 | |
Samacsys Manufacturer | Analog Devices | |
Analog IC - Other Type | ANALOG CIRCUIT | |
JESD-30 Code | R-PDMA-X12 | |
Neg Supply Voltage-Max (Vsup) | -18 V | |
Neg Supply Voltage-Min (Vsup) | -13.5 V | |
Neg Supply Voltage-Nom (Vsup) | -15 V | |
Number of Functions | 1 | |
Number of Terminals | 12 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP12/38,.8 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 18 V | |
Supply Voltage-Min (Vsup) | 13.5 V | |
Supply Voltage-Nom (Vsup) | 15 V | |
Surface Mount | NO | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | UNSPECIFIED | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for 1B51AN
This table gives cross-reference parts and alternative options found for 1B51AN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 1B51AN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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1B51BN | Analog Devices Inc | Check for Price | Isolated mV/Thermocouple Signal Conditioner | 1B51AN vs 1B51BN |
1B51AN Frequently Asked Questions (FAQ)
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A good PCB layout for the 1B51AN involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
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To ensure proper biasing, the 1B51AN requires a stable voltage supply, and the input common-mode voltage should be within the specified range. Additionally, the output voltage should be properly terminated, and the device should be operated within the recommended temperature range.
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The maximum power dissipation of the 1B51AN is typically around 1.5W. To prevent overheating, ensure good thermal conductivity between the device and the PCB, use a heat sink if necessary, and keep the device away from other heat sources.
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Yes, the 1B51AN can be used in high-frequency applications up to 500MHz. However, precautions should be taken to minimize parasitic inductance and capacitance, use short traces, and ensure proper termination to prevent signal reflections.
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To troubleshoot issues with the 1B51AN, check the PCB layout for any mistakes or weaknesses, ensure proper power supply decoupling, and verify that the input and output signals are within the specified ranges. Also, check for any signs of overheating or physical damage to the device.