Datasheets
1210B225K250CT by:

Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 2.2uF, Surface Mount, 1210, CHIP

Part Details for 1210B225K250CT by Fenghua (HK) Electronics Ltd

Overview of 1210B225K250CT by Fenghua (HK) Electronics Ltd

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Electronic Manufacturing Entertainment and Gaming

Part Details for 1210B225K250CT

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1210B225K250CT Part Data Attributes

1210B225K250CT Fenghua (HK) Electronics Ltd
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1210B225K250CT Fenghua (HK) Electronics Ltd Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 2.2uF, Surface Mount, 1210, CHIP
Part Life Cycle Code Active
Ihs Manufacturer FENGHUA ADVANCED TECHNOLOGY
Package Description , 1210
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8532.24.00.20
Capacitance 2.2 µF
Capacitor Type CERAMIC CAPACITOR
Dielectric Material CERAMIC
Height 2 mm
Length 3.2 mm
Mounting Feature SURFACE MOUNT
Multilayer Yes
Negative Tolerance 10%
Number of Terminals 2
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Shape RECTANGULAR PACKAGE
Package Style SMT
Packing Method TAPE
Positive Tolerance 10%
Rated (DC) Voltage (URdc) 25 V
Size Code 1210
Surface Mount YES
Temperature Characteristics Code X7R
Temperature Coefficient 15% ppm/°C
Terminal Finish Copper (Cu)
Terminal Shape WRAPAROUND
Width 2.5 mm

Alternate Parts for 1210B225K250CT

This table gives cross-reference parts and alternative options found for 1210B225K250CT. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 1210B225K250CT, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CL32B225KAIGLNE Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 2.2uF, 1210, Samsung Electro-Mechanics 1210B225K250CT vs CL32B225KAIGLNE
1210B225K250NT Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 2.2uF, Surface Mount, 1210, CHIP Fenghua (HK) Electronics Ltd 1210B225K250CT vs 1210B225K250NT
C3225X7R1E225K200AM Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 2.2uF, Surface Mount, 1210, CHIP, HALOGEN FREE, ROHS AND REACH COMPLIANT TDK Corporation 1210B225K250CT vs C3225X7R1E225K200AM
B37950K0225K062 CAPACITOR, CERAMIC, MULTILAYER, 25V, X7R, 2.2uF, SURFACE MOUNT, 1210, CHIP TDK Epcos 1210B225K250CT vs B37950K0225K062
CM32X7R225K25KL Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 2.2uF, 1210, KYOCERA Corporation 1210B225K250CT vs CM32X7R225K25KL
CL32B225KAINCNE Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 2.2uF, 1210, Samsung Electro-Mechanics 1210B225K250CT vs CL32B225KAINCNE
CM32X7R225K25AL CAPACITOR, CERAMIC, MULTILAYER, 25 V, X7R, 2.2 uF, SURFACE MOUNT, 1210, CHIP, ROHS COMPLIANT KYOCERA Crystal Device Corporation 1210B225K250CT vs CM32X7R225K25AL
CL32B225KAIALNE Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 2.2uF, 1210, Samsung Electro-Mechanics 1210B225K250CT vs CL32B225KAIALNE
CM32X7R225K25AT CAPACITOR, CERAMIC, MULTILAYER, 25 V, X7R, 2.2 uF, SURFACE MOUNT, 1210, CHIP, ROHS COMPLIANT KYOCERA Crystal Device Corporation 1210B225K250CT vs CM32X7R225K25AT
CL32B225KAIANNE Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 2.2uF, 1210, Samsung Electro-Mechanics 1210B225K250CT vs CL32B225KAIANNE

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