Part Details for 10AX115N3F45E2LG by Intel Corporation
Overview of 10AX115N3F45E2LG by Intel Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for 10AX115N3F45E2LG
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
10AX115N3F45E2LG-ND
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DigiKey | IC FPGA 768 I/O 1932FCBGA Min Qty: 3 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$10,434.6333 | Buy Now |
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Quest Components | 19 |
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$6,638.0595 | Buy Now |
Part Details for 10AX115N3F45E2LG
10AX115N3F45E2LG CAD Models
10AX115N3F45E2LG Part Data Attributes
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10AX115N3F45E2LG
Intel Corporation
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Datasheet
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10AX115N3F45E2LG
Intel Corporation
Field Programmable Gate Array, 1150000-Cell, CMOS, PBGA1932, 45 X 45 MM, ROHS COMPLIANT, FBGA-1932
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| JESD-30 Code | S-PBGA-B1932 | |
| JESD-609 Code | e1 | |
| Length | 45 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 42720 | |
| Number of Inputs | 768 | |
| Number of Logic Cells | 1150000 | |
| Number of Outputs | 768 | |
| Number of Terminals | 1932 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Organization | 42720 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.5 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | TSMC | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 45 mm |