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Part Details for 10AX032E2F29I2SG by Intel Corporation
Overview of 10AX032E2F29I2SG by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Education and Research
Internet of Things (IoT)
Environmental Monitoring
Computing and Data Storage
Financial Technology (Fintech)
Healthcare
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Electronic Manufacturing
Communication and Networking
Robotics and Drones
Price & Stock for 10AX032E2F29I2SG
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
10AX032E2F29I2SG-ND
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DigiKey | IC FPGA 360 I/O 780FBGA Min Qty: 3 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$1,504.8000 | Buy Now |
Part Details for 10AX032E2F29I2SG
10AX032E2F29I2SG CAD Models
10AX032E2F29I2SG Part Data Attributes
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10AX032E2F29I2SG
Intel Corporation
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Datasheet
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10AX032E2F29I2SG
Intel Corporation
Field Programmable Gate Array, 320000-Cell, CMOS, PBGA780, 29 X 29 MM, ROHS COMPLIANT, FBGA-780
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| JESD-30 Code | S-PBGA-B780 | |
| Length | 29 mm | |
| Number of CLBs | 11990 | |
| Number of Inputs | 360 | |
| Number of Logic Cells | 320000 | |
| Number of Outputs | 360 | |
| Number of Terminals | 780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 11990 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.35 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | TSMC | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 29 mm |