There are no models available for this part yet.
Overview of 1-HCS175-51TG by Advanced Interconnections Corp
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Security and Surveillance
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 0805HS-151TGBC | Coilcraft Inc | General Purpose Inductor, 0.15uH, 2%, 1 Element, Ceramic-Core, SMD, 0806, CHIP, 0805 | |
| 0805HS-151TGBB | Coilcraft Inc | General Purpose Inductor, 0.15uH, 2%, 1 Element, Ceramic-Core, SMD, 0806, CHIP, 0805 | |
| 1008HS-751TGLC | Coilcraft Inc | General Purpose Inductor, 0.75uH, 2%, 1 Element, Ceramic-Core, SMD, 1008, CHIP, 1008, ROHS COMPLIANT |
CAD Models for 1-HCS175-51TG by Advanced Interconnections Corp
Part Data Attributes for 1-HCS175-51TG by Advanced Interconnections Corp
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|
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|---|---|
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Rohs Code
|
No
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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ADVANCED INTERCONNECTIONS CORP
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Reach Compliance Code
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compliant
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ECCN Code
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EAR99
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HTS Code
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8536.69.40.40
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Additional Feature
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2.5 OZ. AVG. INSERTION FORCE
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Body Breadth
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1.4 inch
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Body Depth
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0.13 inch
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Body Length
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1.4 inch
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Contact Configuration
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14X14
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Contact Finish Mating
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AU ON NI
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Contact Finish Termination
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Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
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Contact Material
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BE-CU
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Contact Style
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RND PIN-SKT
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Device Socket Type
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IC SOCKET
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Device Type Used On
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PGA175
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Housing Material
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GLASS FILLED THERMOPLASTIC
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JESD-609 Code
|
e0
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Mating Contact Pitch
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0.1 inch
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Mounting Style
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STRAIGHT
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Number of Contacts
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175
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Operating Temperature-Max
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260 °C
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Operating Temperature-Min
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-60 °C
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PCB Contact Pattern
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RECTANGULAR
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PCB Contact Row Spacing
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0.1 mm
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Terminal Pitch
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2.54 mm
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Termination Type
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SOLDER
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