There are no models available for this part yet.
Overview of 0805B681K251N by Fenghua (HK) Electronics Ltd
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Space Technology
Aerospace and Defense
Renewable Energy
Automotive
CAD Models for 0805B681K251N by Fenghua (HK) Electronics Ltd
Part Data Attributes for 0805B681K251N by Fenghua (HK) Electronics Ltd
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|---|---|
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Part Life Cycle Code
|
Active
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Ihs Manufacturer
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FENGHUA ADVANCED TECHNOLOGY
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Package Description
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, 0805
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Reach Compliance Code
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unknown
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ECCN Code
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EAR99
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Capacitance
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0.00068 µF
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Capacitor Type
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CERAMIC CAPACITOR
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Dielectric Material
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CERAMIC
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Height
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1.25 mm
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JESD-609 Code
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e3
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Length
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2 mm
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Mounting Feature
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SURFACE MOUNT
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Multilayer
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Yes
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Negative Tolerance
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10%
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Number of Terminals
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2
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Package Style
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SMT
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Packing Method
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Bulk
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Positive Tolerance
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10%
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Rated (DC) Voltage (URdc)
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250 V
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Size Code
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0805
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Surface Mount
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YES
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Temperature Characteristics Code
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X7R
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Temperature Coefficient
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15% ppm/°C
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Terminal Finish
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TIN OVER NICKEL
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Terminal Shape
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WRAPAROUND
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Width
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1.25 mm
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Alternate Parts for 0805B681K251N
This table gives cross-reference parts and alternative options found for 0805B681K251N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 0805B681K251N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 0805B681K251NB | Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.00068uF, 0805, | Fenghua (HK) Electronics Ltd | 0805B681K251N vs 0805B681K251NB |
| C0805X681KARAC3316 | Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.00068uF, Surface Mount, 0805, CHIP | KEMET Corporation | 0805B681K251N vs C0805X681KARAC3316 |
| 0805B681K251NT | Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.00068uF, 0805, | Fenghua (HK) Electronics Ltd | 0805B681K251N vs 0805B681K251NT |
| CGA4J3X7R2E682K | CAPACITOR, CERAMIC | TDK Corporation | 0805B681K251N vs CGA4J3X7R2E682K |
| C0805X7R681K251NPH | Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.00068uF, 0805, | Eyang Technology Development Co Ltd | 0805B681K251N vs C0805X7R681K251NPH |
| 0805H2500681KXB | Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.00068uF, Surface Mount, 0805, CHIP | Knowles Capacitors | 0805B681K251N vs 0805H2500681KXB |
| 0805F2500681KXT | Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.00068uF, Surface Mount, 0805, CHIP | Knowles Capacitors | 0805B681K251N vs 0805F2500681KXT |
| 0805B681K251ST | Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.00068uF, 0805, | Fenghua (HK) Electronics Ltd | 0805B681K251N vs 0805B681K251ST |
| SH21B681K251CT | Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.00068uF, Surface Mount, 0805, CHIP | Walsin Technology Corporation | 0805B681K251N vs SH21B681K251CT |
| 0805B681K251S | Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.00068uF, 0805, | Fenghua (HK) Electronics Ltd | 0805B681K251N vs 0805B681K251S |