ZL50233QCG1 vs ZL50232QC feature comparison

ZL50233QCG1 Zarlink Semiconductor Inc

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ZL50232QC Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC MICROSEMI CORP
Package Description 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BED, LQFP-100 14 X 14 MM, 1.40 MM HEIGHT, LQFP-100
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G100 S-PQFP-G100
JESD-609 Code e3 e0
Length 14 mm 14 mm
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 100 100
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Telecom IC Type ISDN ECHO CANCELLER ISDN ECHO CANCELLER
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm 14 mm
Base Number Matches 3 2
Part Package Code QFP
Pin Count 100

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