ZL50051GAC vs ZL50031QEG1 feature comparison

ZL50051GAC Zarlink Semiconductor Inc

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ZL50031QEG1 Zarlink Semiconductor Inc

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC ZARLINK SEMICONDUCTOR INC
Package Description 17 X 17 MM, 1.61 MM HEIGHT, 1 MM PITCH, PLASTIC, MS-034, BGA-256 28 X 28 MM, 3.37 MM HEIGHT, LEAD FREE, MS-029, MQFP-256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B256 S-PQFP-G256
JESD-609 Code e0 e3
Length 17 mm 28 mm
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA HFQFP
Package Equivalence Code BGA256,16X16,40 QFP256,1.2SQ,16
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 3.7 mm
Supply Voltage-Nom 1.8 V 3.3 V
Surface Mount YES YES
Telecom IC Type DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.4 mm
Terminal Position BOTTOM QUAD
Width 17 mm 28 mm
Base Number Matches 2 3