ZL50051GAC
vs
ZL50031QEG1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ZARLINK SEMICONDUCTOR INC
ZARLINK SEMICONDUCTOR INC
Package Description
17 X 17 MM, 1.61 MM HEIGHT, 1 MM PITCH, PLASTIC, MS-034, BGA-256
28 X 28 MM, 3.37 MM HEIGHT, LEAD FREE, MS-029, MQFP-256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B256
S-PQFP-G256
JESD-609 Code
e0
e3
Length
17 mm
28 mm
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
HFQFP
Package Equivalence Code
BGA256,16X16,40
QFP256,1.2SQ,16
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.8 mm
3.7 mm
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
DIGITAL TIME SWITCH
DIGITAL TIME SWITCH
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.4 mm
Terminal Position
BOTTOM
QUAD
Width
17 mm
28 mm
Base Number Matches
2
3