ZL50051GAC vs ZL50023QCG1 feature comparison

ZL50051GAC Zarlink Semiconductor Inc

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ZL50023QCG1 Microchip Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC MICROCHIP TECHNOLOGY INC
Package Description 17 X 17 MM, 1.61 MM HEIGHT, 1 MM PITCH, PLASTIC, MS-034, BGA-256 LQFP-256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B256 S-PQFP-G256
JESD-609 Code e0
Length 17 mm 28 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFQFP
Package Equivalence Code BGA256,16X16,40 QFP256,1.2SQ,16
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 1.8 mm 1.6 mm
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Telecom IC Type DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.4 mm
Terminal Position BOTTOM QUAD
Width 17 mm 28 mm
Base Number Matches 2 1
Factory Lead Time 8 Weeks
Supply Current-Max 130 mA

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