ZL50031QEG1
vs
ZL50016GAC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ZARLINK SEMICONDUCTOR INC
ZARLINK SEMICONDUCTOR INC
Package Description
28 X 28 MM, 3.37 MM HEIGHT, LEAD FREE, MS-029, MQFP-256
17 X 17 MM, 1.61 MM HEIGHT, PLASTIC, MS-034, BGA-256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G256
S-PBGA-B256
JESD-609 Code
e3
e0
Length
28 mm
17 mm
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HFQFP
BGA
Package Equivalence Code
QFP256,1.2SQ,16
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, HEAT SINK/SLUG, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.7 mm
1.8 mm
Supply Voltage-Nom
3.3 V
1.8 V
Surface Mount
YES
YES
Telecom IC Type
DIGITAL TIME SWITCH
DIGITAL TIME SWITCH
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.4 mm
1 mm
Terminal Position
QUAD
BOTTOM
Width
28 mm
17 mm
Base Number Matches
3
2