ZL50023GAG2
vs
ZL50031QEG1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
ZARLINK SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA, BGA256,16X16,40
|
28 X 28 MM, 3.37 MM HEIGHT, LEAD FREE, MS-029, MQFP-256
|
| Pin Count |
256
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G256
|
| JESD-609 Code |
e1
|
e3
|
| Length |
17 mm
|
28 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
HFQFP
|
| Package Equivalence Code |
BGA256,16X16,40
|
QFP256,1.2SQ,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.8 mm
|
3.7 mm
|
| Supply Current-Max |
130 mA
|
|
| Supply Voltage-Nom |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
DIGITAL TIME SWITCH
|
DIGITAL TIME SWITCH
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
MATTE TIN
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
17 mm
|
28 mm
|
| Base Number Matches |
3
|
3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare ZL50023GAG2 with alternatives