ZL50022GAC
vs
ZL50017QCC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROSEMI CORP
ZARLINK SEMICONDUCTOR INC
Part Package Code
BGA
Package Description
17 X 17 MM, 1.61 MM HEIGHT, PLASTIC, MS-034, BGA-256
LFQFP, QFP256,1.2SQ,16
Pin Count
256
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B256
S-PQFP-G256
JESD-609 Code
e0
e0
Length
17 mm
28 mm
Number of Functions
1
1
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFQFP
Package Equivalence Code
BGA256,16X16,40
QFP256,1.2SQ,16
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.8 mm
1.6 mm
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Telecom IC Type
DIGITAL TIME SWITCH
DIGITAL TIME SWITCH
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.4 mm
Terminal Position
BOTTOM
QUAD
Width
17 mm
28 mm
Base Number Matches
2
2
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
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