ZL30121GGG2V2
vs
ZL30123GGG
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
BGA
|
|
| Package Description |
LEAD FREE, 9 X 9 MM, 0.80 MM PITCH, CABGA-100
|
|
| Pin Count |
100
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| JESD-30 Code |
S-PBGA-B100
|
|
| JESD-609 Code |
e1
|
|
| Length |
9 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
100
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
FBGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.72 mm
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
9 mm
|
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare ZL30121GGG2V2 with alternatives
Compare ZL30123GGG with alternatives