ZL30116GGG2
vs
ZL30116GGG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ZARLINK SEMICONDUCTOR INC
MICROSEMI CORP
Package Description
FBGA, BGA100,10X10,32
FBGA, BGA100,10X10,32
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Applications
SDH; SONET
JESD-30 Code
S-PBGA-B100
S-PBGA-B100
JESD-609 Code
e1
e0
Length
9 mm
9 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
100
100
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Equivalence Code
BGA100,10X10,32
BGA100,10X10,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.72 mm
1.72 mm
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Telecom IC Type
ATM/SONET/SDH SUPPORT CIRCUIT
ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
9 mm
9 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
100
Compare ZL30116GGG2 with alternatives
Compare ZL30116GGG with alternatives