ZL30111QDG vs ZL30111QDG feature comparison

ZL30111QDG Zarlink Semiconductor Inc

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ZL30111QDG Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC MICROSEMI CORP
Package Description TFQFP, QFP, TQFP64,.47SQ
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Applications SONET;SDH
JESD-30 Code S-PQFP-G64 S-PQFP-G64
Length 10 mm
Number of Functions 1
Number of Terminals 64 64
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFQFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Nom 1.8 V
Surface Mount YES YES
Telecom IC Type ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 10 mm
Base Number Matches 2 2
Rohs Code No
Part Package Code QFP
Pin Count 64
Package Equivalence Code TQFP64,.47SQ
Supply Current-Max 47 mA

Compare ZL30111QDG with alternatives

Compare ZL30111QDG with alternatives