ZGP323HEP4008C
vs
ZGP323HEP4008G
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
IXYS CORP
|
IXYS CORP
|
Part Package Code |
DIP
|
DIP
|
Package Description |
PLASTIC, DIP-40
|
GREEN, PLASTIC, DIP-40
|
Pin Count |
40
|
40
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
8 MHz
|
8 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDIP-T40
|
R-PDIP-T40
|
JESD-609 Code |
e0
|
e3
|
Length |
52.325 mm
|
52.325 mm
|
Number of I/O Lines |
32
|
32
|
Number of Terminals |
40
|
40
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
240
|
255
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM (words) |
8192
|
8192
|
ROM Programmability |
OTPROM
|
OTPROM
|
Seated Height-Max |
4.24 mm
|
4.24 mm
|
Speed |
8 MHz
|
8 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2 V
|
3.6 V
|
Supply Voltage-Nom |
3.6 V
|
3.6 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
15.24 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
CPU Family |
|
Z8
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
DIP40,.6
|
RAM (bytes) |
|
237
|
Supply Current-Max |
|
15 mA
|
|
|
|