Z8L38210FSG
vs
IDT79RC32V364-100DAGI
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
IXYS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
PLASTIC, QFP-144
|
20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
|
Pin Count |
144
|
144
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
24
|
32
|
Bit Size |
16
|
32
|
Boundary Scan |
NO
|
YES
|
Clock Frequency-Max |
20 MHz
|
50 MHz
|
External Data Bus Width |
16
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
YES
|
JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
Length |
28 mm
|
20 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
LFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.07 mm
|
1.6 mm
|
Speed |
10 MHz
|
100 MHz
|
Supply Voltage-Max |
3.63 V
|
3.465 V
|
Supply Voltage-Min |
2.97 V
|
3.135 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
28 mm
|
20 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
3A991.A.2
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare Z8L38210FSG with alternatives
Compare IDT79RC32V364-100DAGI with alternatives