Z8F082APB020EG
vs
Z8F082APB020SC
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ZILOG INC
|
IXYS CORP
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP8,.3
|
PLASTIC, DIP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
Z8
|
Z8
|
Clock Frequency-Max |
20 MHz
|
20 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e0
|
Length |
9.4 mm
|
9.4 mm
|
Number of I/O Lines |
6
|
6
|
Number of Terminals |
8
|
8
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
105 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
1024
|
1024
|
ROM (words) |
8192
|
8192
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
4.62 mm
|
4.62 mm
|
Speed |
20 MHz
|
20 MHz
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2.7 V
|
3 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
Boundary Scan |
|
NO
|
|
|
|
Compare Z8F082APB020EG with alternatives
Compare Z8F082APB020SC with alternatives