Z86E0812PEC
vs
Z86E0812PSC1903
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ZILOG INC
|
IXYS CORP
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP18,.3
|
PLASTIC, DIP-18
|
Pin Count |
18
|
18
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
Z8
|
Z8
|
Clock Frequency-Max |
12 MHz
|
12 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDIP-T18
|
R-PDIP-T18
|
JESD-609 Code |
e0
|
e0
|
Length |
22.86 mm
|
22.86 mm
|
Number of I/O Lines |
14
|
14
|
Number of Terminals |
18
|
18
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
105 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP18,.3
|
DIP18,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
240
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
125
|
125
|
ROM (words) |
2048
|
2048
|
ROM Programmability |
OTPROM
|
OTPROM
|
Seated Height-Max |
4.24 mm
|
4.24 mm
|
Speed |
12 MHz
|
12 MHz
|
Supply Current-Max |
20 mA
|
20 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
2
|
|
|
|
Compare Z86E0812PEC with alternatives
Compare Z86E0812PSC1903 with alternatives