Z8530BB6V vs Z8530BD1N feature comparison

Z8530BB6V STMicroelectronics

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Z8530BD1N STMicroelectronics

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code DIP DIP
Package Description PLASTIC, DIP-40 CERAMIC, DIP-40
Pin Count 40 40
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS
Boundary Scan NO NO
Bus Compatibility 8080; Z80; 6800; 68000; MULTIBUS 8080; Z80; 6800; 68000; MULTIBUS
Clock Frequency-Max 8 MHz 8 MHz
Communication Protocol ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC ASYNC, BIT
Data Encoding/Decoding Method NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL (MANCHESTER) NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL (MANCHESTER)
Data Transfer Rate-Max 0.25 MBps 0.25 MBps
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-CDIP-T40
JESD-609 Code e0 e0
Low Power Mode NO NO
Number of DMA Channels
Number of I/O Lines
Number of Serial I/Os 2 2
Number of Terminals 40 40
On Chip Data RAM Width
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP WDIP
Package Equivalence Code DIP40,.6 DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Supply Current-Max 250 mA 250 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology NMOS NMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1

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