Z8030AB1
vs
Z8030ADC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP40,.6
Pin Count
40
40
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
8
8
Boundary Scan
NO
NO
Bus Compatibility
Z8000
8086; Z8000
Clock Frequency-Max
6 MHz
6 MHz
Communication Protocol
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC
Data Encoding/Decoding Method
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
Data Transfer Rate-Max
0.125 MBps
0.125 MBps
External Data Bus Width
8
8
JESD-30 Code
R-PDIP-T40
R-GDIP-T40
Length
52.07 mm
52.324 mm
Low Power Mode
NO
NO
Number of DMA Channels
Number of I/O Lines
Number of Serial I/Os
2
2
Number of Terminals
40
40
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
0
Supply Current-Max
250 mA
250 mA
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
1
4
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP40,.6
Seated Height-Max
5.715 mm
Terminal Finish
TIN LEAD
Compare Z8030AB1 with alternatives
Compare Z8030ADC with alternatives