Z8018008PE
vs
MC68HC000LC8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ZILOG INC
MOTOROLA INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP64,.9
Pin Count
64
64
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
19
24
Bit Size
8
32
Boundary Scan
NO
NO
Clock Frequency-Max
8 MHz
8 MHz
External Data Bus Width
8
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-PDIP-T64
R-CDIP-T64
Low Power Mode
YES
NO
Number of Terminals
64
64
Operating Temperature-Max
100 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Speed
8 MHz
8 MHz
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
3
1
Rohs Code
JESD-609 Code
e0
Length
81.28 mm
Number of DMA Channels
Number of External Interrupts
7
Number of Serial I/Os
On Chip Data RAM Width
Package Equivalence Code
DIP64,.9
RAM (words)
0
Seated Height-Max
4.32 mm
Supply Current-Max
25 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
22.86 mm
Compare Z8018008PE with alternatives
Compare MC68HC000LC8 with alternatives