Z16F3211FI20EG
vs
Z16F3211FI20SG
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
IXYS CORP
|
ZILOG INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP-80
|
QFP, QFP80,.7X.9,32
|
Pin Count |
80
|
80
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
24
|
24
|
Bit Size |
16
|
16
|
Clock Frequency-Max |
20 MHz
|
20 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
R-PQFP-G80
|
R-PQFP-G80
|
JESD-609 Code |
e3
|
e3
|
Length |
20 mm
|
20 mm
|
Number of I/O Lines |
60
|
60
|
Number of Terminals |
80
|
80
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
105 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Equivalence Code |
QFP80,.7X.9,32
|
QFP80,.7X.9,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
2048
|
2048
|
ROM (words) |
32768
|
32768
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
3.18 mm
|
3.18 mm
|
Speed |
20 MHz
|
20 MHz
|
Supply Current-Max |
35 mA
|
35 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2.7 V
|
2.7 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
2
|
|
|
|
Compare Z16F3211FI20EG with alternatives
Compare Z16F3211FI20SG with alternatives