Z0103MN,135
vs
MR813
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
SC-73
|
|
| Package Description |
PLASTIC, SC-73, 4 PIN
|
O-PALF-W2
|
| Pin Count |
4
|
|
| Manufacturer Package Code |
SOT223
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.30.00.80
|
|
| Samacsys Manufacturer |
NXP
|
|
| Case Connection |
MAIN TERMINAL 2
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Critical Rate of Rise of Commutation Voltage-Min |
0.5 V/us
|
|
| Critical Rate of Rise of Off-State Voltage-Min |
10 V/us
|
|
| DC Gate Trigger Current-Max |
5 mA
|
|
| DC Gate Trigger Voltage-Max |
1.3 V
|
|
| Holding Current-Max |
7 mA
|
|
| JESD-30 Code |
R-PDSO-G4
|
O-PALF-W2
|
| JESD-609 Code |
e3
|
e0
|
| Leakage Current-Max |
0.5 mA
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
4
|
2
|
| Operating Temperature-Max |
125 °C
|
150 °C
|
| Operating Temperature-Min |
-40 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RMS On-state Current-Max |
1 A
|
|
| Repetitive Peak Off-state Voltage |
600 V
|
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
WIRE
|
| Terminal Position |
DUAL
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Trigger Device Type |
4 QUADRANT LOGIC LEVEL TRIAC
|
|
| Base Number Matches |
2
|
4
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
|
1.2 V
|
| Output Current-Max |
|
1 A
|
| Rep Pk Reverse Voltage-Max |
|
300 V
|
| Reverse Recovery Time-Max |
|
0.75 µs
|
|
|
|
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