YTF840 vs IRF840A feature comparison

YTF840 Toshiba America Electronic Components

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IRF840A Samsung Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP SAMSUNG SEMICONDUCTOR INC
Package Description FLANGE MOUNT, R-PSFM-T3 TO-220, 3 PIN
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Case Connection DRAIN
Configuration SINGLE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 500 V 500 V
Drain Current-Max (ID) 8 A 8 A
Drain-source On Resistance-Max 0.85 Ω 0.85 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-220AB TO-220AB
JESD-30 Code R-PSFM-T3 R-PSFM-T3
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 3 3
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type N-CHANNEL N-CHANNEL
Pulsed Drain Current-Max (IDM) 32 A 32 A
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 8
Part Package Code SFM
Pin Count 3
HTS Code 8541.29.00.95
Avalanche Energy Rating (Eas) 640 mJ
Feedback Cap-Max (Crss) 75 pF
Operating Temperature-Max 150 °C
Power Dissipation Ambient-Max 134 W
Power Dissipation-Max (Abs) 134 W
Turn-off Time-Max (toff) 245 ns
Turn-on Time-Max (ton) 100 ns

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