XRD54L08AID-F
vs
MAX539BESA+
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
EXAR CORP
|
|
| Part Package Code |
SOIC
|
8-SOIC_N-150_MIL
|
| Package Description |
0.150 INCH, GREEN, SOIC-8
|
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
|
| HTS Code |
8542.39.00.01
|
|
| Analog Output Voltage-Max |
3.1 V
|
5 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.9 mm
|
4.9 mm
|
| Linearity Error-Max (EL) |
0.1953%
|
0.0244%
|
| Number of Bits |
8
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Settling Time-Nom (tstl) |
13 µs
|
25 µs
|
| Supply Current-Max |
0.06 mA
|
0.3 mA
|
| Supply Voltage-Nom |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
8-SOIC_N-150_MIL
|
| Date Of Intro |
|
1999-05-25
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare XRD54L08AID-F with alternatives
Compare MAX539BESA+ with alternatives