XR3075XED-F
vs
ISL32455EIUZ-T7A
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
EXAR CORP
|
RENESAS ELECTRONICS CORP
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
MSOP
|
| Package Description |
|
TSSOP,
|
| Pin Count |
|
8
|
| Manufacturer Package Code |
|
M8.118
|
| Factory Lead Time |
|
26 Weeks, 1 Day
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
| Differential Output |
|
YES
|
| Driver Number of Bits |
|
1
|
| Input Characteristics |
|
DIFFERENTIAL SCHMITT TRIGGER
|
| Interface Standard |
|
EIA-485; EIA-422
|
| JESD-30 Code |
|
S-PDSO-G8
|
| JESD-609 Code |
|
e3
|
| Length |
|
3 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Out Swing-Min |
|
1.1 V
|
| Output Low Current-Max |
|
0.005 A
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP8,.19
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Receive Delay-Max |
|
200 ns
|
| Receiver Number of Bits |
|
1
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Current-Max |
|
4.5 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
3 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BICMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Transmit Delay-Max |
|
200 ns
|
| Width |
|
3 mm
|
|
|
|
Compare XR3075XED-F with alternatives
Compare ISL32455EIUZ-T7A with alternatives