XR16M681IL24 vs XR16M581IB25 feature comparison

XR16M681IL24 Exar Corporation

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XR16M581IB25 Exar Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer EXAR CORP EXAR CORP
Part Package Code QFN BGA
Package Description HVQCCN, LCC24,.16SQ,20 VFBGA, BGA25,5X5,20
Pin Count 24 25
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 2.5V SUPPLY ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width 8 8
Boundary Scan NO NO
Clock Frequency-Max 80 MHz 80 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Encoding/Decoding Method NRZ NRZ
Data Transfer Rate-Max 2.5 MBps 2.5 MBps
External Data Bus Width 8 8
JESD-30 Code S-XQCC-N24 S-PBGA-B25
JESD-609 Code e0 e0
Length 4 mm 3 mm
Low Power Mode NO NO
Moisture Sensitivity Level 1
Number of Serial I/Os 1 1
Number of Terminals 24 25
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVQCCN VFBGA
Package Equivalence Code LCC24,.16SQ,20 BGA25,5X5,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 0.8 mm
Supply Voltage-Max 3.63 V 3.63 V
Supply Voltage-Min 2.97 V 2.97 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD BOTTOM
Width 4 mm 3 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 2 2

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